Application: Platform for Ubiquitous Computing
- 6-way VLIW DSP, ARM core, FFT, WLAN BB processor
Technology: 0.18um CMOS
Package: 378 BGA
Die size: 8203 * 8335
ODiN-KZHDSP1000 - 6 Way VLIW DSP
Application: Signal Processor for SDR Applications
Technology: 0.25 CMOS
Package: 208 LQFP
Die size: 9000 * 9500
UV8019 - IEEE 802.11.b Baseband processor
Application: Wireless LAN
Technology: 0.18 CMOS
Package: 244 QPFP
Die size: 4000 * 4500
OLED Driver & Controller
Application: PCS OLED Display
Technology: 0.6 16V CMOS
Package: 407 Bump & TCP
Die size: 4000 * 4500
SCIX-1
Application: Smard Card Interface and Terminal
Technology: 0.35 CMOS
Package: 352 PBGA
Die size: 7890 * 7890
