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  2022

A RISC-V Processor Supporting AMBA AXI Protocol for Embedded Systems
      - Designer : Jeong Won Sik, Kwon Sun Beom, Oh Hyun Woo, Kim Jeongeun
      - Technology : Samsung 28nm RFCMOS(1-poly 8-metal)
      - Tape Out : 2022. 07.18
      - Power Supply : 1.2V
      - Core Size : 2mm x 4mm

A Vehicular Embedded Network Processor based on Cortex-M0
      - Designer : Go Kwanghyun, Cho Kwonneung, Kim Soohee, Jeong Youngwoo
      - Technology : Samsung 28nm RFCMOS(1-poly 8-metal)
      - Tape Out : 2022. 07.18
      - Power Supply : 1.0V
      - Core Size : 2mm x 4mm

Robot-Specific Processor for Autonomous Driving
      - Designer : Jeong Youngwoo, Jeong Yue Ri, Oh Hyun Woo, Go Kwang Hyun
      - Technology : Samsung 28nm RFCMOS(1-poly 8-metal)
      - Tape Out : 2022. 07.18
      - Power Supply : 1.0V
      - Core Size : 2mm x 4mm

AI processor based on Stochastic Computing for Embedded Systems
      - Designer : Kim Jeongeun, Cho Kwonneung, Han Changyeop, Jeong Won Sik
      - Technology : Samsung 28nm CMOS
      - Tape Out : 2022. 07.19
      - Power Supply : 1.2V
      - Core Size : 4mm x 2mm

In-Vehicle Network Processor based on Cortex-M0
      - Designer : Cho Kwon Neung, Kim Jeong Eun, Oh Hyun Woo
      - Technology : TSMC 180nm RFCMOS (1-poly 6-metal)
      - Tape Out : 2022. 03. 16
      - Power Supply : 1.8V
      - Core Size : 3.4mm x 3mm
  2021

A Low Power Embedded AI System for Machine Learning
      - Designer : Jang Su Yeon, Jeong Won Sik, Han Chang Yeop, Hwang Dong Hyun
      - Technology : Samsung 28nm CMOS (1-poly 8-metal)
      - Tape Out : 2021. 07. 19
      - Power Supply : 1.2V
      - Core Size : 2mm x 4mm

A Programmable Embedded AI Processor with Cortex-M0
      - Designer : Cho Kwon Neung, Jeong Young Woo, Oh Hyun Woo, Han Chang Yeop
      - Technology : Samsung 28nm CMOS (1-poly 8-metal)
      - Tape Out : 2021. 07. 19
      - Power Supply : 1.2V
      - Core Size : 2mm x 4mm

In-Vehicle Network Core based on CAN-FD and LIN Controller
      - Designer : Go kwang Hyun, Kim Jeong Eun, Choi Do Young
      - Technology : DBHitek 180nm BCDMOS
      - Tape Out : 2021. 07. 19
      - Power Supply : 5V
      - Core Size : 5mm x 5mm

32-bit processor with posit arithmetic coprocessor for embedded systems
      - Designer : Oh Hyun Woo, Kim Jeong Eun, Choi Do Young, Go Kwang Hyun
      - Technology : Samsung 28nm CMOS
      - Tape Out : 2021. 07. 19
      - Power Supply : 1.2V
      - Core Size : 2mm x 4mm
  2020

Implementation of Lossless Decompression Accelerator Based on Inflate Algorithm
      - Designer : Hwang Gwan beom, Choi Do Young, Oh Hyun Woo, Han Chang Yeop
      - Technology : Samsung 65nm RFCMOS (1-poly 8-metal)
      - Tape Out : 2020. 09. 14
      - Power Supply : 1.2V
      - Core Size : 4mm x 4mm

Communication System with Simple and Fast Communication Error Check Code Based on CRC
      - Designer : Han Chang Yeop, Cho Kwon Neung, Oh Hyun Woo
      - Technology : Magnachip hynix 0.18um CMOS
      - Tape Out : 2020. 06. 01
      - Power Supply : 1.8V
      - Core Size : 3.4mm x 3.4mm

A Low Cost and Low Power Neuromorphic Core for Embedded AI System
      - Designer : Jang Su Yeon, Yoon Young Hyun, Han Chang Yeop
      - Technology : Samsung 65nm RFCMOS (1-poly 8-metal)
      - Tape Out : 2020. 05. 25
      - Power Supply : 1.2V
      - Core Size : 4mm x 4mm

High-Speed automobile communication based on CAN-FD Controller
      - Designer : Choi Do Young, Yoon Young Hyun, Hwang Gwan Beom, Cho Kwon Neung
      - Technology : TSMC 180nm BCDMOS
      - Tape Out : 2020. 05. 13
      - Power Supply : 2.5V
      - Core Size : 2.5mm x 5mm
  2019

Stochastic Computing based Machine Learning for Embedded System
      - Designer : Jang Su Yeon, Han Chang Yeop, Kim Jeong Bum
      - Technology : Magnachip hynix 0.18um CMOS
      - Tape Out : 2019. 11. 25
      - Power Supply : 3.3V
      - Core Size : 3.4mm x 3.4mm

A Low Power AI Processor for Embedded System
      - Designer : Yoon Young Hyun, Hwang Gwan Beom, Choi Do Young
      - Technology : Samsung 65nm CMOSRF (1-poly 8-metal)
      - Tape Out : 2019. 9. 16
      - Power Supply : 1.8V
      - Core Size : 4mm x 4mm

A Low Power SoC for Digital Signal Processing in Embedded System
      - Designer : Hwang Gwan Beom, Yoon Young Hyun, Han Chang Yeop
      - Technology : Magnachip hynix 0.18um CMOS
      - Tape Out : 2019. 6. 17
      - Power Supply : 3.3V
      - Core Size : 3.8mm x 3.8mm

High-Speed Neuromorphic Network Controller for Multiple Neuro-Memories Processing
      - Designer : Choi Do Young, Yoon Young Hyun, Jang Su Yeon
      - Technology : Magnachip hynix 0.35um CMOS
      - Tape Out : 2019. 6. 10
      - Power Supply : 3.3V
      - Core Size : 5mm x 4mm

A Low Power AI Processor for face expression recognition based on k-NN and RBF
      - Designer : Yoon Young Hyun, Jang Su Yeon, Han Chang Yeop, Hwang Gwan Beom
      - Technology : Magnachip hynix 0.35um CMOS
      - Tape Out : 2019. 1. 14
      - Power Supply : 3.3V
      - Core Size : 5mm x 4mm
  2018

CAN FD Controller Based on ISO-11898:2015
      - Designer : Yoon Young Hyun, Oh Jung Hwan, Yang Jun Hyeok
      - Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
      - Tape Out : 2018. 7. 23
      - Power Supply : 3.3V
      - Core Size : 3.8mm x 3.8mm
  2017

Programmable Finger Gesture Recognition based on k-nearest neighbors algorithm
      - Designer : Kim Ji Kwang, Oh Jung Hwan
      - Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
      - Tape Out : 2017. 9. 18
      - Power Supply : 3.3V
      - Core Size : 3.8mm x 3.8mm

Low-power hardware accelerator for Biomedical Signal Processing
      - Designer : Kim Ji Kwang, Gwon Oh Sung, Oh Jung Hwan
      - Technology : SMIC 0.11um CMOS (1-poly 6-metal)
      - Tape Out : 2017. 9. 11
      - Digital Power Supply : 1.2V
      - Analog Supply Voltage : 3.3V
      - Core Size : 3.5mm x 3.5mm

CAN FD Controller for In-Vehicle Network Communication
      - Designer : Oh Jung Hwan, Yang Jun Hyeok, Yoon Young Hyun
      - Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
      - Tape Out : 2017. 5. 22
      - Power Supply : 3.3V
      - Core Size : 3.7mm x 3.7mm
  2016

In-Vehicle Communication Network CAN FD for Wearable Devices
      - Designer : Shin Jung Woo, Lee Sang Muk, Oh Jung Hwan
      - Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
      - Tape Out : 2016. 9. 19
      - Power Supply : 3.3V
      - Core Size : 3.8mm x 3.8mm

  LZ4 Compression Hardware Accelerator
      - Designer : Lee Sang Muk, Oh Jung Hwan
      - Technology : Samsung 65nm CMOSRF (1-poly 8-metal)
      - Tape Out : 2016. 8. 1
      - Power Supply : 3.3V
      - Core Size : 4mm x 4mm

  32bit Low Power Microcontroller
      - Designer : Gwon Oh Sung, Lee Sang Muk
      - Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
      - Tape Out : 2016. 7. 18
      - Power Supply : 3.3V
      - Core Size : 3.8mm x 3.8mm

  Multi-purpose Controllers for Subminiature Sensor Embedded in Wearable Device
      - Designer : Kim Ji Kwang, Oh Jung Hwan
      - Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
      - Tape Out : 2016. 6. 13
      - Power Supply : 3.3V
      - Core Size : 5mm x 4mm

  HPU01: Low-power Processor for Healthcare Wearable Device
      - Designer : Gwon Oh Sung, Kim Ji Kwang
      - Technology : SMIC 0.11um CMOS (1-poly 8-metal)
      - Tape Out : 2016. 6. 9
      - Power Supply : 1.2V
      - Core Size : 3.5mm x 3.5mm

  128-bit AES Block Cipher Core for Three Operation Mode
      - Designer : Lee Sang Muk, Oh Jung Hwan
      - Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
      - Tape Out : 2016. 5. 16
      - Power Supply : 3.3V
      - Core Size : 3.8mm x 3.8mm

  Accelerating JPEG Image Compression Engine
      - Designer : Shin Jung Woo, Lee Sang Muk, Oh Jung Hwan
      - Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
      - Tape Out : 2016. 1. 11
      - Power Supply : 3.3V
      - Core Size : 5mm x 4mm
      - Operating Frequency : 28MHz
  2015


  LZ4 Compression Engine
      - Designer : Jang Ji Hoon, Lee Seong Mo, Lee Sang Muk, Shin Jung Woo
      - Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
      - Tape Out : 2015. 9. 7
      - Power Supply : 1.8V, 3.3V
      - Core Size : 3.8mm x 3.8mm
      - Operating Frequency : 50MHz

  DMA Controller for Image Data Processing
      - Designer : Lee Seong Mo, Jang Ji Hoon
      - Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
      - Tape Out : 2015. 6. 8
      - Power Supply : 3.3V
      - Core Size : 3mm x 2mm
      - Operating Frequency : 50MHz
  2014


  Hybrid PCM Memory Controller
      - Designer : Lee Sang Muk
      - Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
      - Tape Out : 2014. 12. 1
      - Power Supply : 3.3V
      - Core Size : 2.3mm x 1.3mm
      - Operating Frequency : 100MHz

  LZ4 Compression Accelerator for Hadoop Storage Appliance
      - Designer : Jang Ji Hoon
      - Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
      - Tape Out : 2014. 11. 24
      - Power Supply : 1.8V
      - Core Size : 0.6mm x 1.5mm
      - Operating Frequency : 50MHz

  Cloud Device SoC for Zero-Client
      - Designer : Kim Sang Don, Jang Ji Hoon
      - Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
      - Tape Out : 2014. 6. 30
      - Power Supply : 3.3V
      - Core Size : 1.8mm x 1.6mm
      - Operating Frequency : 50MHz



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