An Error Correcting Code Encoder Utilizing Orthogonal Latin Square Code for HBM Application
- Designer : Yue Ri Jeong, Sang Ho Lee, Seongmo An, Jin Yeol Kim
- Technology : Samsung 28nm FD-SOI
- Tape Out : 2024.09.09
- Power Supply : 1.1V/1.8V
- Core Size : 4mm x 4mm
- Operating Frequency : 50M/200MHz
- Designer : Yue Ri Jeong, Sang Ho Lee, Seongmo An, Jin Yeol Kim
- Technology : Samsung 28nm FD-SOI
- Tape Out : 2024.09.09
- Power Supply : 1.1V/1.8V
- Core Size : 4mm x 4mm
- Operating Frequency : 50M/200MHz
Convoltution-based Feature Extractor Equipped with an Improved Systolic Array Architecture
- Designer : Park Joungmin, Lee Sangho, Shin Jinyoung, Kim Raehyeong
- Technology : Samsung 28nm LPP
- Tape Out : 2024.07.18
- Power Supply : 1.2V
- Core Size : 4mm x 4mm
- Operating Frequency : 50M/200MHz
- Designer : Park Joungmin, Lee Sangho, Shin Jinyoung, Kim Raehyeong
- Technology : Samsung 28nm LPP
- Tape Out : 2024.07.18
- Power Supply : 1.2V
- Core Size : 4mm x 4mm
- Operating Frequency : 50M/200MHz
A Network System Processor for Next-Generation Robots based on Cortex-M3
- Designer : Go Kwanghyun, Kim Soohee, Jeong Yue Ri, An Seongmo
- Technology : Samsung 28nm FD-SOI
- Tape Out : 2023.11.27
- Power Supply : 1.1V/1.8V
- Core Size : 4mm x 4mm
- Operating Frequency : 50M/200MHz
- Designer : Go Kwanghyun, Kim Soohee, Jeong Yue Ri, An Seongmo
- Technology : Samsung 28nm FD-SOI
- Tape Out : 2023.11.27
- Power Supply : 1.1V/1.8V
- Core Size : 4mm x 4mm
- Operating Frequency : 50M/200MHz
A RISC-V Processor Supporting AMBA AXI Protocol for Embedded Systems
- Designer : Jeong Won Sik, Kwon Sun Beom, Oh Hyun Woo, Kim Jeongeun
- Technology : Samsung 28nm RFCMOS(1-poly 8-metal)
- Tape Out : 2022. 07.18
- Power Supply : 1.2V
- Core Size : 2mm x 4mm
- Designer : Jeong Won Sik, Kwon Sun Beom, Oh Hyun Woo, Kim Jeongeun
- Technology : Samsung 28nm RFCMOS(1-poly 8-metal)
- Tape Out : 2022. 07.18
- Power Supply : 1.2V
- Core Size : 2mm x 4mm
A Vehicular Embedded Network Processor based on Cortex-M0
- Designer : Go Kwanghyun, Cho Kwonneung, Kim Soohee, Jeong Youngwoo
- Technology : Samsung 28nm RFCMOS(1-poly 8-metal)
- Tape Out : 2022. 07.18
- Power Supply : 1.0V
- Core Size : 2mm x 4mm
- Designer : Go Kwanghyun, Cho Kwonneung, Kim Soohee, Jeong Youngwoo
- Technology : Samsung 28nm RFCMOS(1-poly 8-metal)
- Tape Out : 2022. 07.18
- Power Supply : 1.0V
- Core Size : 2mm x 4mm
Robot-Specific Processor for Autonomous Driving
- Designer : Jeong Youngwoo, Jeong Yue Ri, Oh Hyun Woo, Go Kwang Hyun
- Technology : Samsung 28nm RFCMOS(1-poly 8-metal)
- Tape Out : 2022. 07.18
- Power Supply : 1.0V
- Core Size : 2mm x 4mm
- Designer : Jeong Youngwoo, Jeong Yue Ri, Oh Hyun Woo, Go Kwang Hyun
- Technology : Samsung 28nm RFCMOS(1-poly 8-metal)
- Tape Out : 2022. 07.18
- Power Supply : 1.0V
- Core Size : 2mm x 4mm
AI processor based on Stochastic Computing for Embedded Systems
- Designer : Kim Jeongeun, Cho Kwonneung, Han Changyeop, Jeong Won Sik
- Technology : Samsung 28nm CMOS
- Tape Out : 2022. 07.19
- Power Supply : 1.2V
- Core Size : 4mm x 2mm
- Designer : Kim Jeongeun, Cho Kwonneung, Han Changyeop, Jeong Won Sik
- Technology : Samsung 28nm CMOS
- Tape Out : 2022. 07.19
- Power Supply : 1.2V
- Core Size : 4mm x 2mm
In-Vehicle Network Processor based on Cortex-M0
- Designer : Cho Kwon Neung, Kim Jeong Eun, Oh Hyun Woo
- Technology : TSMC 180nm RFCMOS (1-poly 6-metal)
- Tape Out : 2022. 03. 16
- Power Supply : 1.8V
- Core Size : 3.4mm x 3mm
- Designer : Cho Kwon Neung, Kim Jeong Eun, Oh Hyun Woo
- Technology : TSMC 180nm RFCMOS (1-poly 6-metal)
- Tape Out : 2022. 03. 16
- Power Supply : 1.8V
- Core Size : 3.4mm x 3mm
A Low Power Embedded AI System for Machine Learning
- Designer : Jang Su Yeon, Jeong Won Sik, Han Chang Yeop, Hwang Dong Hyun
- Technology : Samsung 28nm CMOS (1-poly 8-metal)
- Tape Out : 2021. 07. 19
- Power Supply : 1.2V
- Core Size : 2mm x 4mm
- Designer : Jang Su Yeon, Jeong Won Sik, Han Chang Yeop, Hwang Dong Hyun
- Technology : Samsung 28nm CMOS (1-poly 8-metal)
- Tape Out : 2021. 07. 19
- Power Supply : 1.2V
- Core Size : 2mm x 4mm
A Programmable Embedded AI Processor with Cortex-M0
- Designer : Cho Kwon Neung, Jeong Young Woo, Oh Hyun Woo, Han Chang Yeop
- Technology : Samsung 28nm CMOS (1-poly 8-metal)
- Tape Out : 2021. 07. 19
- Power Supply : 1.2V
- Core Size : 2mm x 4mm
- Designer : Cho Kwon Neung, Jeong Young Woo, Oh Hyun Woo, Han Chang Yeop
- Technology : Samsung 28nm CMOS (1-poly 8-metal)
- Tape Out : 2021. 07. 19
- Power Supply : 1.2V
- Core Size : 2mm x 4mm
In-Vehicle Network Core based on CAN-FD and LIN Controller
- Designer : Go kwang Hyun, Kim Jeong Eun, Choi Do Young
- Technology : DBHitek 180nm BCDMOS
- Tape Out : 2021. 07. 19
- Power Supply : 5V
- Core Size : 5mm x 5mm
- Designer : Go kwang Hyun, Kim Jeong Eun, Choi Do Young
- Technology : DBHitek 180nm BCDMOS
- Tape Out : 2021. 07. 19
- Power Supply : 5V
- Core Size : 5mm x 5mm
32-bit processor with posit arithmetic coprocessor for embedded systems
- Designer : Oh Hyun Woo, Kim Jeong Eun, Choi Do Young, Go Kwang Hyun
- Technology : Samsung 28nm CMOS
- Tape Out : 2021. 07. 19
- Power Supply : 1.2V
- Core Size : 2mm x 4mm
- Designer : Oh Hyun Woo, Kim Jeong Eun, Choi Do Young, Go Kwang Hyun
- Technology : Samsung 28nm CMOS
- Tape Out : 2021. 07. 19
- Power Supply : 1.2V
- Core Size : 2mm x 4mm
Implementation of Lossless Decompression Accelerator Based on Inflate Algorithm
- Designer : Hwang Gwan beom, Choi Do Young, Oh Hyun Woo, Han Chang Yeop
- Technology : Samsung 65nm RFCMOS (1-poly 8-metal)
- Tape Out : 2020. 09. 14
- Power Supply : 1.2V
- Core Size : 4mm x 4mm
- Designer : Hwang Gwan beom, Choi Do Young, Oh Hyun Woo, Han Chang Yeop
- Technology : Samsung 65nm RFCMOS (1-poly 8-metal)
- Tape Out : 2020. 09. 14
- Power Supply : 1.2V
- Core Size : 4mm x 4mm
Communication System with Simple and Fast Communication Error Check Code Based on CRC
- Designer : Han Chang Yeop, Cho Kwon Neung, Oh Hyun Woo
- Technology : Magnachip hynix 0.18um CMOS
- Tape Out : 2020. 06. 01
- Power Supply : 1.8V
- Core Size : 3.4mm x 3.4mm
- Designer : Han Chang Yeop, Cho Kwon Neung, Oh Hyun Woo
- Technology : Magnachip hynix 0.18um CMOS
- Tape Out : 2020. 06. 01
- Power Supply : 1.8V
- Core Size : 3.4mm x 3.4mm
A Low Cost and Low Power Neuromorphic Core for Embedded AI System
- Designer : Jang Su Yeon, Yoon Young Hyun, Han Chang Yeop
- Technology : Samsung 65nm RFCMOS (1-poly 8-metal)
- Tape Out : 2020. 05. 25
- Power Supply : 1.2V
- Core Size : 4mm x 4mm
- Designer : Jang Su Yeon, Yoon Young Hyun, Han Chang Yeop
- Technology : Samsung 65nm RFCMOS (1-poly 8-metal)
- Tape Out : 2020. 05. 25
- Power Supply : 1.2V
- Core Size : 4mm x 4mm
High-Speed automobile communication based on CAN-FD Controller
- Designer : Choi Do Young, Yoon Young Hyun, Hwang Gwan Beom, Cho Kwon Neung
- Technology : TSMC 180nm BCDMOS
- Tape Out : 2020. 05. 13
- Power Supply : 2.5V
- Core Size : 2.5mm x 5mm
- Designer : Choi Do Young, Yoon Young Hyun, Hwang Gwan Beom, Cho Kwon Neung
- Technology : TSMC 180nm BCDMOS
- Tape Out : 2020. 05. 13
- Power Supply : 2.5V
- Core Size : 2.5mm x 5mm
Stochastic Computing based Machine Learning for Embedded System
- Designer : Jang Su Yeon, Han Chang Yeop, Kim Jeong Bum
- Technology : Magnachip hynix 0.18um CMOS
- Tape Out : 2019. 11. 25
- Power Supply : 3.3V
- Core Size : 3.4mm x 3.4mm
- Designer : Jang Su Yeon, Han Chang Yeop, Kim Jeong Bum
- Technology : Magnachip hynix 0.18um CMOS
- Tape Out : 2019. 11. 25
- Power Supply : 3.3V
- Core Size : 3.4mm x 3.4mm
A Low Power AI Processor for Embedded System
- Designer : Yoon Young Hyun, Hwang Gwan Beom, Choi Do Young
- Technology : Samsung 65nm CMOSRF (1-poly 8-metal)
- Tape Out : 2019. 9. 16
- Power Supply : 1.8V
- Core Size : 4mm x 4mm
- Designer : Yoon Young Hyun, Hwang Gwan Beom, Choi Do Young
- Technology : Samsung 65nm CMOSRF (1-poly 8-metal)
- Tape Out : 2019. 9. 16
- Power Supply : 1.8V
- Core Size : 4mm x 4mm
A Low Power SoC for Digital Signal Processing in Embedded System
- Designer : Hwang Gwan Beom, Yoon Young Hyun, Han Chang Yeop
- Technology : Magnachip hynix 0.18um CMOS
- Tape Out : 2019. 6. 17
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
- Designer : Hwang Gwan Beom, Yoon Young Hyun, Han Chang Yeop
- Technology : Magnachip hynix 0.18um CMOS
- Tape Out : 2019. 6. 17
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
High-Speed Neuromorphic Network Controller for Multiple Neuro-Memories Processing
- Designer : Choi Do Young, Yoon Young Hyun, Jang Su Yeon
- Technology : Magnachip hynix 0.35um CMOS
- Tape Out : 2019. 6. 10
- Power Supply : 3.3V
- Core Size : 5mm x 4mm
- Designer : Choi Do Young, Yoon Young Hyun, Jang Su Yeon
- Technology : Magnachip hynix 0.35um CMOS
- Tape Out : 2019. 6. 10
- Power Supply : 3.3V
- Core Size : 5mm x 4mm
A Low Power AI Processor for face expression recognition based on k-NN and RBF
- Designer : Yoon Young Hyun, Jang Su Yeon, Han Chang Yeop, Hwang Gwan Beom
- Technology : Magnachip hynix 0.35um CMOS
- Tape Out : 2019. 1. 14
- Power Supply : 3.3V
- Core Size : 5mm x 4mm
- Designer : Yoon Young Hyun, Jang Su Yeon, Han Chang Yeop, Hwang Gwan Beom
- Technology : Magnachip hynix 0.35um CMOS
- Tape Out : 2019. 1. 14
- Power Supply : 3.3V
- Core Size : 5mm x 4mm
CAN FD Controller Based on ISO-11898:2015
- Designer : Yoon Young Hyun, Oh Jung Hwan, Yang Jun Hyeok
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2018. 7. 23
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
- Designer : Yoon Young Hyun, Oh Jung Hwan, Yang Jun Hyeok
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2018. 7. 23
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
Programmable Finger Gesture Recognition based on k-nearest neighbors algorithm
- Designer : Kim Ji Kwang, Oh Jung Hwan
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2017. 9. 18
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
- Designer : Kim Ji Kwang, Oh Jung Hwan
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2017. 9. 18
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
Low-power hardware accelerator for Biomedical Signal Processing
- Designer : Kim Ji Kwang, Gwon Oh Sung, Oh Jung Hwan
- Technology : SMIC 0.11um CMOS (1-poly 6-metal)
- Tape Out : 2017. 9. 11
- Digital Power Supply : 1.2V
- Analog Supply Voltage : 3.3V
- Core Size : 3.5mm x 3.5mm
- Designer : Kim Ji Kwang, Gwon Oh Sung, Oh Jung Hwan
- Technology : SMIC 0.11um CMOS (1-poly 6-metal)
- Tape Out : 2017. 9. 11
- Digital Power Supply : 1.2V
- Analog Supply Voltage : 3.3V
- Core Size : 3.5mm x 3.5mm
CAN FD Controller for In-Vehicle Network Communication
- Designer : Oh Jung Hwan, Yang Jun Hyeok, Yoon Young Hyun
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2017. 5. 22
- Power Supply : 3.3V
- Core Size : 3.7mm x 3.7mm
- Designer : Oh Jung Hwan, Yang Jun Hyeok, Yoon Young Hyun
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2017. 5. 22
- Power Supply : 3.3V
- Core Size : 3.7mm x 3.7mm
In-Vehicle Communication Network CAN FD for Wearable Devices
- Designer : Shin Jung Woo, Lee Sang Muk, Oh Jung Hwan
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2016. 9. 19
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
- Designer : Shin Jung Woo, Lee Sang Muk, Oh Jung Hwan
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2016. 9. 19
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
LZ4 Compression Hardware Accelerator
- Designer : Lee Sang Muk, Oh Jung Hwan
- Technology : Samsung 65nm CMOSRF (1-poly 8-metal)
- Tape Out : 2016. 8. 1
- Power Supply : 3.3V
- Core Size : 4mm x 4mm
- Designer : Lee Sang Muk, Oh Jung Hwan
- Technology : Samsung 65nm CMOSRF (1-poly 8-metal)
- Tape Out : 2016. 8. 1
- Power Supply : 3.3V
- Core Size : 4mm x 4mm
32bit Low Power Microcontroller
- Designer : Gwon Oh Sung, Lee Sang Muk
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2016. 7. 18
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
- Designer : Gwon Oh Sung, Lee Sang Muk
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2016. 7. 18
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
Multi-purpose Controllers for Subminiature Sensor Embedded in Wearable Device
- Designer : Kim Ji Kwang, Oh Jung Hwan
- Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape Out : 2016. 6. 13
- Power Supply : 3.3V
- Core Size : 5mm x 4mm
- Designer : Kim Ji Kwang, Oh Jung Hwan
- Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape Out : 2016. 6. 13
- Power Supply : 3.3V
- Core Size : 5mm x 4mm
HPU01: Low-power Processor for Healthcare Wearable Device
- Designer : Gwon Oh Sung, Kim Ji Kwang
- Technology : SMIC 0.11um CMOS (1-poly 8-metal)
- Tape Out : 2016. 6. 9
- Power Supply : 1.2V
- Core Size : 3.5mm x 3.5mm
- Designer : Gwon Oh Sung, Kim Ji Kwang
- Technology : SMIC 0.11um CMOS (1-poly 8-metal)
- Tape Out : 2016. 6. 9
- Power Supply : 1.2V
- Core Size : 3.5mm x 3.5mm
128-bit AES Block Cipher Core for Three Operation Mode
- Designer : Lee Sang Muk, Oh Jung Hwan
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2016. 5. 16
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
- Designer : Lee Sang Muk, Oh Jung Hwan
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2016. 5. 16
- Power Supply : 3.3V
- Core Size : 3.8mm x 3.8mm
Accelerating JPEG Image Compression Engine
- Designer : Shin Jung Woo, Lee Sang Muk, Oh Jung Hwan
- Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape Out : 2016. 1. 11
- Power Supply : 3.3V
- Core Size : 5mm x 4mm
- Operating Frequency : 28MHz
- Designer : Shin Jung Woo, Lee Sang Muk, Oh Jung Hwan
- Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape Out : 2016. 1. 11
- Power Supply : 3.3V
- Core Size : 5mm x 4mm
- Operating Frequency : 28MHz
LZ4 Compression Engine
- Designer : Jang Ji Hoon, Lee Seong Mo, Lee Sang Muk, Shin Jung Woo
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2015. 9. 7
- Power Supply : 1.8V, 3.3V
- Core Size : 3.8mm x 3.8mm
- Operating Frequency : 50MHz
- Designer : Jang Ji Hoon, Lee Seong Mo, Lee Sang Muk, Shin Jung Woo
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2015. 9. 7
- Power Supply : 1.8V, 3.3V
- Core Size : 3.8mm x 3.8mm
- Operating Frequency : 50MHz
DMA Controller for Image Data Processing
- Designer : Lee Seong Mo, Jang Ji Hoon
- Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape Out : 2015. 6. 8
- Power Supply : 3.3V
- Core Size : 3mm x 2mm
- Operating Frequency : 50MHz
- Designer : Lee Seong Mo, Jang Ji Hoon
- Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape Out : 2015. 6. 8
- Power Supply : 3.3V
- Core Size : 3mm x 2mm
- Operating Frequency : 50MHz
Hybrid PCM Memory Controller
- Designer : Lee Sang Muk
- Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape Out : 2014. 12. 1
- Power Supply : 3.3V
- Core Size : 2.3mm x 1.3mm
- Operating Frequency : 100MHz
- Designer : Lee Sang Muk
- Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape Out : 2014. 12. 1
- Power Supply : 3.3V
- Core Size : 2.3mm x 1.3mm
- Operating Frequency : 100MHz
LZ4 Compression Accelerator for Hadoop Storage Appliance
- Designer : Jang Ji Hoon
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2014. 11. 24
- Power Supply : 1.8V
- Core Size : 0.6mm x 1.5mm
- Operating Frequency : 50MHz
- Designer : Jang Ji Hoon
- Technology : Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape Out : 2014. 11. 24
- Power Supply : 1.8V
- Core Size : 0.6mm x 1.5mm
- Operating Frequency : 50MHz
Cloud Device SoC for Zero-Client
- Designer : Kim Sang Don, Jang Ji Hoon
- Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape Out : 2014. 6. 30
- Power Supply : 3.3V
- Core Size : 1.8mm x 1.6mm
- Operating Frequency : 50MHz
- Designer : Kim Sang Don, Jang Ji Hoon
- Technology : Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape Out : 2014. 6. 30
- Power Supply : 3.3V
- Core Size : 1.8mm x 1.6mm
- Operating Frequency : 50MHz
