Junghwan Oh (2019)
Dept. of Electronic and Information Engineering Seoul National University of Science and Technology
232 Gongneung-ro, Nowon-gu, 01811, Seoul, KOREA
ohjunghwan
seoultech.ac.kr
Education & Experiences
Engineer, Samsung Advanced Institute of Technology (SAIT)
2019.02, Master of Science in Electronic Engineering, Seoul National University of Science and Technology.
- Thesis Title : "Automotive SoC Architecture for In-Vehicle Networks"
2017.03 - 2019.02, Graduate Student, Dept. of Electronic Engineering, Seoul National University of Science and Technology.
2015.04 - 2019.02, Research Assistant, SoC Platform Lab, Seoul National University of Science and Technology.
2013.03 - 2017.02, Undergraduate Student, Dept. of Electronic and Information Engineering, Seoul National University of Science and Technology.
2019.02, Master of Science in Electronic Engineering, Seoul National University of Science and Technology.
- Thesis Title : "Automotive SoC Architecture for In-Vehicle Networks"
2017.03 - 2019.02, Graduate Student, Dept. of Electronic Engineering, Seoul National University of Science and Technology.
2015.04 - 2019.02, Research Assistant, SoC Platform Lab, Seoul National University of Science and Technology.
2013.03 - 2017.02, Undergraduate Student, Dept. of Electronic and Information Engineering, Seoul National University of Science and Technology.
Research Interests
System-on-Chip; Low-power and high-performance SoC, SoC for spiking neural networks, SoC for automotive system,
hardware accelerator; low-power hardware accelerator, lz4 compression accelerator, machine learning accelerator,
Multicore-based encryption accelerator, FPGA based implementation and optimization for high performance accelerators
hardware accelerator; low-power hardware accelerator, lz4 compression accelerator, machine learning accelerator,
Multicore-based encryption accelerator, FPGA based implementation and optimization for high performance accelerators
Projects
- 저전력 독립운용이 가능한 내장형 인공지능 모듈 및 내비게이션 응용 서비스 기술 개발산업통상자원부, 2017-2020.
- Classified Topic현대엔지비, 2017-2018.
- 스마트키 기능을 포함하는 밴드형 웨어러블 디바이스 및 핵심기술 개발산업통상자원부, 2014-2017.
- 국산 CPU코어 내장 수 mW급 저전력 모바일 헬스케어 SOC개발산업통상자원부, 2015-2017.
- 단일노드 48TB 이상을 지원하는 개방형 하둡 스토리지 어플라이언스 개발미래창조과학부, 2013-2016.
- 다중코어 암호연산기의 데이터 처리를 위한 스케줄링 기법 연구국가보안기술연구소, 2015-2015.
Publications
International Journals
- 7 A CRC Comparison-Based Screen Data Management for Energy Efficient Virtual Desktop InfrastructureIEEE Access · Vol. 13 · pp. 102859-102868 · Jul. 2025
- 6 An FPGA-Based ECU for Remote Reconfiguration in Automotive SystemsMicromachines · Vol. 12 · No. 1309 · Oct. 2021
- 5 Energy Efficient and Low-Cost Server Architecture for Hadoop Storage ApplianceKSII Transactions on Internet and Information Systems (TIIS) · Vol. 14 · No. 12 · pp. 4648-4663 · Dec. 2020
- 4 Design of Low-Power SoC for Wearable Healthcare DeviceJournal of Circuits, Systems, and Computers (JCSC) · Vol. 29 · No. 6 · May 2020
- 3 Design of a 128-bit AES Block Cipher CoreIDEC Journal of Integrated Circuits and Systems (JICAS) · Vol. 3 · No. 4 · pp. 41-46 · 2017
- 2 Design of hardware accelerator for Lempel-Ziv 4 (LZ4) compressionIEICE Electronics Express (ELEX) · Vol. 14 · No. 11 · pp. 20170399 · 2017
- 1 Design of a DMA Controller for Loss-less Image ProcessingIDEC Journal of Integrated Circuits and Systems (JICAS) · Vol. 2 · No. 2 · pp. 1-6 · 2016
International Conferences
- 17 An FPGA-based Electronic Control Unit Controller for Automotive Systems37th IEEE International Conference on Consumer Electronics (ICCE) · Las Vegas, Nevada · Jan. 2019
- 16 In-System Remote Reconfiguration for Automotive Device37th IEEE International Conference on Consumer Electronics (ICCE) · Las Vegas, Nevada · Jan. 2019
- 15 2D Line Draw Hardware Accelerator for Tiny Embedded Systems37th IEEE International Conference on Consumer Electronics (ICCE) · Las Vegas, Nevada · Jan. 2019
- 14 Real-time PPG Monitoring System for Mobile Healthcare Devices21st International Symposium on Consumer Electronics (ISCE) · Kuala Lumpur · Nov. 2017
- 13 Design of CAN - CAN FD Bridge for In-Vehicle Network14th International SoC Design Conference (ISOCC) · Seoul · Nov. 2017
- 12 A Hardware Accelerator for Lempel-Ziv 4 (LZ4) Compression14th International SoC Design Conference (ISOCC CDC) · Seoul · Nov. 2017
- 11 Design of A Low-power Processor for Internet of Things14th International SoC Design Conference (ISOCC CDC) · Seoul · Nov. 2017
- 10 Design of a CAN FD controller for In-Vehicle Infotainment System14th International SoC Design Conference (ISOCC CDC) · Seoul · Nov. 2017
- 9 A 128-bit AES Block Cipher Core with Three Operation Modes14th International SoC Design Conference (ISOCC CDC) · Seoul · Nov. 2017
- 8 Design of Read-out IC for Wearable Computing14th International SoC Design Conference (ISOCC CDC) · Seoul · Nov. 2017
- 7 In-Vehicle CAN FD Network Controller for Smart Wearable Devices35th IEEE International Conference on Consumer Electronics (ICCE) · Las Vegas, Nevada · Jan. 2017
- 6 Live Demonstration : CAN FD Platform for In-Vehicle Network13th IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) · Jeju · Oct. 2016
- 5 Live Demonstration : An FPGA Based Hardware Compression Accelerator for Hadoop System13th IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) · Jeju · Oct. 2016
- 4 A DMA Controller for Loss-less Image Processing13th International SoC Design Conference (ISOCC CDC) · Jeju · Oct. 2016
- 3 A LZ4 Compression Acceleration Engine13th International SoC Design Conference (ISOCC CDC) · Jeju · Oct. 2016
- 2 Accelerating JPEG Image Compression for Audio Video Bridging13th International SoC Design Conference (ISOCC CDC) · Jeju · Oct. 2016
- 1 CAN FD Controller for In-Vehicle System13th International SoC Design Conference (ISOCC) · Jeju · Oct. 2016
Korean Journals
- 2
- 1
Korean Conferences
- 9
- 8
- 7
- 6
- 5
- 4
- 3
- 2
- 1
Chips
2018
CAN FD Controller Based on ISO-11898:2015
Younghyun Yoon, Junghwan Oh, Junhyeok Yang, Seung Eun LEE
- Tech
- Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape-out
- 2018.07.23
- Core
- 3.8mm x 3.8mm
- Power
- 3.3V
2017
Programmable Finger Gesture Recognition based on k-nearest neighbors algorithm
Jikwang Kim, Junghwan Oh, Seung Eun LEE
- Tech
- Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape-out
- 2017.09.18
- Core
- 3.8mm x 3.8mm
- Power
- 3.3V
Low-power hardware accelerator for Biomedical Signal Processing
Jikwang Kim, Ohseong Gwon, Junghwan Oh, Seung Eun LEE
- Tech
- SMIC 0.11um CMOS (1-poly 6-metal)
- Tape-out
- 2017.09.11
- Core
- 3.5mm x 3.5mm
- Power
- Digital 1.2V / Analog 3.3V
CAN FD Controller for In-Vehicle Network Communication
Junghwan Oh, Junhyeok Yang, Younghyun Yoon, Seung Eun LEE
- Tech
- Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape-out
- 2017.05.22
- Core
- 3.7mm x 3.7mm
- Power
- 3.3V
2016
In-Vehicle Communication Network CAN FD for Wearable Devices
Jungwoo Shin, SangMuk Lee, Junghwan Oh, Seung Eun LEE
- Tech
- Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape-out
- 2016.09.19
- Core
- 3.8mm x 3.8mm
- Power
- 3.3V
LZ4 Compression Hardware Accelerator
SangMuk Lee, Junghwan Oh, Seung Eun LEE
- Tech
- Samsung 65nm CMOSRF (1-poly 8-metal)
- Tape-out
- 2016.08.01
- Core
- 4mm x 4mm
- Power
- 3.3V
Multi-purpose Controllers for Subminiature Sensor Embedded in Wearable Device
Jikwang Kim, Junghwan Oh, Seung Eun LEE
- Tech
- Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape-out
- 2016.06.13
- Core
- 5mm x 4mm
- Power
- 3.3V
128-bit AES Block Cipher Core for Three Operation Mode
SangMuk Lee, Junghwan Oh, Seung Eun LEE
- Tech
- Magnachip hynix 0.18um CMOS (1-poly 6-metal)
- Tape-out
- 2016.05.16
- Core
- 3.8mm x 3.8mm
- Power
- 3.3V
Accelerating JPEG Image Compression Engine
Jungwoo Shin, SangMuk Lee, Junghwan Oh, Seung Eun LEE
- Tech
- Magnachip hynix 0.35um CMOS (2-poly 4-metal)
- Tape-out
- 2016.01.11
- Freq
- 28MHz
- Core
- 5mm x 4mm
- Power
- 3.3V
Chip Design Contest
- 7. "A Hardware Accelerator for Lempel-Ziv 4 (LZ4) Compression",
Sang Muk Lee, Jung Hwan Oh, and Seung Eun Lee,
14th International SoC Design Conference (ISOCC CDC 2017), Seoul, Korea, Nov. 2017. - 6. "Design of A Low-power Processor for Internet of Things",
Oh Seong Gwon, Jung Hwan Oh, Jae won Lee, and Seung Eun Lee,
14th International SoC Design Conference (ISOCC CDC 2017), Seoul, Korea, Nov. 2017. - 5. "Design of a CAN FD controller for In-Vehicle Infotainment System",
Jung Woo Shin, Jung Hwan Oh, Jong Uk Wi, and Seung Eun Lee,
14th International SoC Design Conference (ISOCC CDC 2017), Seoul, Korea, Nov. 2017. - 4. "A 128-bit AES Block Cipher Core with Three Operation Modes",
Sang Muk Lee, Jung Hwan Oh, and Seung Eun Lee,
14th International SoC Design Conference (ISOCC CDC 2017), Seoul, Korea, Nov. 2017. - 3. "A 128-bit AES Block Cipher Core with Three Operation Modes",
Jung Hwan Oh, Sang Muk Lee, and Seung Eun Lee,
14th International SoC Design Conference (ISOCC CDC 2017), Seoul, Korea, Nov. 2017. - 2. "A DMA Controller for Loss-less Image Processing",
Jung Hwan Oh, Seong Mo Lee, Ji Hoon Jang, Sang Muk Lee, and Seung Eun Lee,
13th International SoC Design Conference (ISOCC 2016), Jeju, Oct. 2016. - 1. "A LZ4 Compression Acceleration Engine",
Jung Hwan Oh, Ji Hoon Jang, and Seung Eun Lee,
13th International SoC Design Conference (ISOCC 2016), Jeju, Oct. 2016.
Presentations
- 4."Essential roles of exploiting internal parallelism of flash memory based solid state drives in high-speed data processing",Seoultech, Dec. 2017.
- 3."FTL Design Exploration in Reconfigurable High-Performance SSD (RHPSSD) for Server Applications",Seoultech, Oct. 2017.
- 2."Master Coursework Summary ", Seoultech, Oct. 2017.
- 1."Razor: A Low-Power Pipeline Based on Circuit-Level Timing Speculation ",SPL meeting, Aug. 2015.
Awards
- 2018.08.05-11. KSIA - 인피니언 연계 자동차용 반도체 전문인력 양성 교육 과정 우수
Skills
- FPGA Prototyping, ASIC Design
- High-level Computer Language: C Programing, JAVA
- Analysis Language: MATLAB
- EDA tools: ModelSim, ORCAD Pspice, QuartusII, Xilinx ISE, Xilinx Vivado, IC Compiler, Design Compiler, Astro, VCS, NCsim, PrimeTime
Training
2018.01.10-01.11 - Deep Learning: 이해와 응용 (TensorFlow, Darknet, Tiny-DNN), IDEC.
2017.08.21-09.01 - 인피니언 연계 자동차용 반도체 전문인력 양성과정[심화], KSIA, Infineon.
2017.08.09-08.11 - Xilinx ZYNQ Device 설계 교육, IDEC.
2017.07.03-07.14 - 인피니언 연계 자동차용 반도체 전문인력 양성과정[기본], KSIA, Infineon.
2017.03.23 - 반도체 기반 IoT 플랫폼(삼성 IoT 플랫폼 ARTIK 활용), IDEC.
2017.03.08-03.09 - OrCAD (Allegro) PCB를 이용한 PCB 설계, IDEC.
2017.02.14-02.15 - [IDEC 연구원 교육]MS180 Digital Layout 설계 방법, IDEC.
2017.02.07-02.09 - 기가비트 이더넷 제어기 설계와 응용설계, IDEC.
2017.01.02-01.06 - MPW Design training, IDEC.
2016.08.16-08.19 - Cortex_M0 DesignStart 기반의 SoC플랫폼 구성 및 활용, IDEC.
2016.08.01-08.03 - IC Compiler 사용법 및 활용예, IDEC.
2016.07.11-07.14 - 스마트 모바일 AP기반 SoC구조 및 주변장치 응용, IDEC.
2016.07.04-07.07 - 지능형 웨어러블 시스템 설계, IDEC.
2016.05.24 - 삼성 65nm 설계설명회, IDEC.
2016.02.25 - Education for EISC development environment, ADChips.
2016.01.12-01.15 - Verilog HDL 이론및 응용, IDEC.
2015.12.28 - Zynq-Z7020 기반 SoC 설계, HUINS.
2015.09.7-09.10 - MPW Design training, IDEC.
2015.08.24-08.25 - 디지털 신호처리를 위한 고성능 SoC 설계, IDEC.
2015.08.20 - 매그나칩/SK하이닉스 0.35um 설계설명회, IDEC.
2015.08.18-08.20 - 안드로이드 플랫폼 개발과정 (리눅스 포팅, 디바이스 드라이버, 안드로이드 빌드), HUINS.
2015.08.13 - 창의설계 코딩 기법 교육, HUINS.
2015.07.06-07.08 - Full-custom 설계 입문, IDEC.
2017.08.21-09.01 - 인피니언 연계 자동차용 반도체 전문인력 양성과정[심화], KSIA, Infineon.
2017.08.09-08.11 - Xilinx ZYNQ Device 설계 교육, IDEC.
2017.07.03-07.14 - 인피니언 연계 자동차용 반도체 전문인력 양성과정[기본], KSIA, Infineon.
2017.03.23 - 반도체 기반 IoT 플랫폼(삼성 IoT 플랫폼 ARTIK 활용), IDEC.
2017.03.08-03.09 - OrCAD (Allegro) PCB를 이용한 PCB 설계, IDEC.
2017.02.14-02.15 - [IDEC 연구원 교육]MS180 Digital Layout 설계 방법, IDEC.
2017.02.07-02.09 - 기가비트 이더넷 제어기 설계와 응용설계, IDEC.
2017.01.02-01.06 - MPW Design training, IDEC.
2016.08.16-08.19 - Cortex_M0 DesignStart 기반의 SoC플랫폼 구성 및 활용, IDEC.
2016.08.01-08.03 - IC Compiler 사용법 및 활용예, IDEC.
2016.07.11-07.14 - 스마트 모바일 AP기반 SoC구조 및 주변장치 응용, IDEC.
2016.07.04-07.07 - 지능형 웨어러블 시스템 설계, IDEC.
2016.05.24 - 삼성 65nm 설계설명회, IDEC.
2016.02.25 - Education for EISC development environment, ADChips.
2016.01.12-01.15 - Verilog HDL 이론및 응용, IDEC.
2015.12.28 - Zynq-Z7020 기반 SoC 설계, HUINS.
2015.09.7-09.10 - MPW Design training, IDEC.
2015.08.24-08.25 - 디지털 신호처리를 위한 고성능 SoC 설계, IDEC.
2015.08.20 - 매그나칩/SK하이닉스 0.35um 설계설명회, IDEC.
2015.08.18-08.20 - 안드로이드 플랫폼 개발과정 (리눅스 포팅, 디바이스 드라이버, 안드로이드 빌드), HUINS.
2015.08.13 - 창의설계 코딩 기법 교육, HUINS.
2015.07.06-07.08 - Full-custom 설계 입문, IDEC.
Graduate Courses
VLSI for Digital Signal Processing, Semiconductor Integrated Circuit Design II, Speech and Audio Processing,
Computer Applied Circuit Design, Embedded Software, Advanced Computer Architecture,
Special topic in Network-on-Chip, Advanced Digital Signal Processing,
SoC Design Methodology, Master Thesis I/II
Computer Applied Circuit Design, Embedded Software, Advanced Computer Architecture,
Special topic in Network-on-Chip, Advanced Digital Signal Processing,
SoC Design Methodology, Master Thesis I/II
Undergraduate Courses
Computer Programming(C Programming), Digital Logic Circuit, Electromagnetics, Engineering Circuit Analysis,
Electrical and Electronic Experiments, Engineering Mathmatics, Signals and Systems, Semiconductor Engineering,
Microwave Engineering, Computer Application System Design, Electronic Circuits, Microprocessor,
Mobile Programming, Advanced Semiconductor Devices, Computer Architecture, Application of Microprocessor,
Digital Signal Processing and Applications, Image Processing, Internet Protocol, Communication System, Capstone Design(1),
Mobile Communications Engineering, Embedded System, Capstone Design(2)
Electrical and Electronic Experiments, Engineering Mathmatics, Signals and Systems, Semiconductor Engineering,
Microwave Engineering, Computer Application System Design, Electronic Circuits, Microprocessor,
Mobile Programming, Advanced Semiconductor Devices, Computer Architecture, Application of Microprocessor,
Digital Signal Processing and Applications, Image Processing, Internet Protocol, Communication System, Capstone Design(1),
Mobile Communications Engineering, Embedded System, Capstone Design(2)